Radiation-Hardened Electronics Market Price, Production, Share by Region and Segment by Types to 2022

Radiation hardening is the process of producing electronic components and systems unaffected by destruction or failures triggered by ionizing radiations like those that are faced in outer space, during nuclear accidents or even around nuclear reactors. Radiation hardening components are centered on non-hardened equivalents with optimum design and production variabilities that condense the vulnerability to radiation damage. 

Maximum semiconductor electronic components are vulnerable to radiation damage.  Radiation-hardened products are classically verified to one or more subsequent effect tests such as enhanced low dose rate effects (ELDRS), neutron and proton displacement damage, ionizing dose (TID), etc.

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The usual sources of exposure of electronics to ionizing radiations include nuclear reactors in power plant for sensors, control circuits, residual radiation from isotopes in chip packaging materials, nuclear explosions in concern with military electronics, cosmic radiations for spacecraft, particle accelerators for control electronics like particle detector devices, and so on. There are a number of factors that propel the growth of the global Radiation-Hardened Electronics Market such as the several applications in defense, space, communication and etc.

On the other hand, there are factors that hamper the growth of the global Radiation-Hardened Electronics Market like the high expenditure on the development as well as design related to the development of components. The global Radiation-Hardened Electronics Market is classified on the basis of manufacturing technique, component, application, end–users, and geography.  On the basis of manufacturing technique, the global Radiation-Hardened Electronics Market is classified as Radiation Hardening by Design (RHBD) and Radiation Hardening by Process (RHBP). On the basis of component, the global Radiation-Hardened Electronics Market is classified as Power Management, ASIC, Logic, Memory, and FPGA.

During the forecast period, the Power Management component is projected to rise at the highest rate of the global Radiation-Hardened Electronics Market. The factors that drive the growth of Power Management component include an amplified demand for diodes, transistors, and MOSFETs in several applications such as Space and Defense. MOSFETs are the extensively utilized Power Management components by more or less all the industries. In addition, there are also progressively more high-tech improvements that are principally concentrating on incorporating Radiation-Hardened Electronics Power Management component chipsets in numerous devices.

On the basis of application, the global Radiation-Hardened Electronics market is classified as Space (Satellite), Aerospace & Defense, and Nuclear Power Plant. In 2015, the global Radiation-Hardened Electronics market was dominated by Space (Satellite) sector. The Space (Satellite) sector is further classified into commercial applications and military applications. The factor that propels the growth of Space (Satellite) application is the rising number of space operations directed all over the world. On the basis of end-users, the global Radiation-Hardened Electronics Market is classified as Government, Defense and military, and Commercial.

On the basis of geography, the global Radiation-Hardened Electronics Market is classified as North America, Europe, Asia Pacific, and Rest of the World. The North American market accounts for the major share of the global Radiation-Hardened Electronics Market. It is traced by Europe and Asia Pacific. The largest share in the North American region is dominated by U.S.; traced by Canada and Mexico. This large market share is contributed to the rising demand for Radiation-Hardened Electronics components subsequently due to existence of large number of Radiation-Hardened Electronics component manufacturers.

Some of the prominent players that fuel the growth of global Radiation-Hardened Electronics Market include Microsemi Corporation, Atmel Corporation, Xilinx, Inc., Intersil Corporation, Texas Instruments, Inc., BAE Systems, Honeywell Aerospace, STMicroelectronics NV, Maxwell Technologies, Inc., and Linear Technology Corporation.

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